Low-Molecular-Weight Polyamide Resin for Epoxy Coatings & Flooring SE-5703B is a high-viscosity, low-molecular-weight polyamide resin diluted with xylene. It is used as a curing agent for epoxy resins and is widely applied in the preparation of room-temperature-curing solvent-based epoxy resin coatings, heavy-duty anti-corrosion coatings, floor paints (epoxy flooring), and adhesives. It features relatively low viscosity for easy handling. When combined with epoxy resin, the